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TE0803-02-03EG-1EB

TE0803-02-03EG-1EB

TE0803-02-03EG-1EB

Trenz Electronic GmbH

MPU Core Zynq UltraScale+ XCZU3EG-1SFVC784E 2.05 x 2.99 52mmx76mm 0°C~85°C 128MB B2B TE0803 4GB

SOT-23

TE0803-02-03EG-1EB Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 12 Weeks
Operating Temperature 0°C~85°C
Series TE0803
Size / Dimension 2.05 x 2.99 52mmx76mm
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Connector Type B2B
RAM Size 4GB
Core Processor Zynq UltraScale+ XCZU3EG-1SFVC784E
Module/Board Type MPU Core
Flash Size 128MB
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $591.60000 $591.6
TE0803-02-03EG-1EB Product Details

TE0803-02-03EG-1EB Overview


MPU Core is the module or board type of the microcontroller.With Zynq UltraScale+ XCZU3EG-1SFVC784E cores, microprocessor chip is powered by a processor.The default setting of the microcontroller is 0°C~85°C.MCU electronics 128MB has a flash size of 128MB.Connector type B2B refers to the type of connector.A member of the TE0803 Series, MCU chip has an LCD screen.Software runs normally with RAM size 4GB when the RAM size is reduced.

TE0803-02-03EG-1EB Features


Core processor of Zynq UltraScale+ XCZU3EG-1SFVC784E
Flash size of 128MB


TE0803-02-03EG-1EB Applications


There are a lot of Trenz Electronic GmbH
TE0803-02-03EG-1EB Microcontroller, Microprocessor, FPGA Modules applications.


  • Embedded Control Processing
  • Embedded User Interfaces
  • Test and Measurement
  • Medical Devices
  • Data Acquisition
  • Industrial Control
  • Process Control
  • Process Monitoring
  • Healthcare Monitoring
  • Patient Monitoring

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