TE0803-02-04CG-1EA datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available on our website
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TE0803-02-04CG-1EA Datasheet
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Specifications
Name
Value
Type
Parameter
Operating Temperature
0°C~85°C
Series
TE0803
Size / Dimension
2.05 x 2.99 52mmx76mm
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
Not Applicable
Connector Type
B2B
RAM Size
2GB
Core Processor
Zynq UltraScale+ XCZU4CG-1SFVC784E
Module/Board Type
MPU Core
Flash Size
128MB
TE0803-02-04CG-1EA Product Details
TE0803-02-04CG-1EA Overview
MPU Core is the type of module or board that is used in this microcontroller.Processors with Zynq UltraScale+ XCZU4CG-1SFVC784E cores drive it.In order to use the microcontroller, the default setting is 0°C~85°C.This MCU electronics has a size of 128MB in terms of its flash.B2B' stands for connector type.In the TE0803 series, this is one of the microcontrollers.This is done to make sure that the software is able to run normally and that the RAM size is reduced to 2GB.
TE0803-02-04CG-1EA Features
Core processor of Zynq UltraScale+ XCZU4CG-1SFVC784E Flash size of 128MB
TE0803-02-04CG-1EA Applications
There are a lot of Trenz Electronic GmbH TE0803-02-04CG-1EA Microcontroller, Microprocessor, FPGA Modules applications.