TE0803-03-2AE11-A datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available on our website
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TE0803-03-2AE11-A Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Operating Temperature
0°C~85°C
Series
TE0803
Size / Dimension
2.05 x 2.99 52mmx76mm
Part Status
Active
Moisture Sensitivity Level (MSL)
Not Applicable
Connector Type
B2B
RAM Size
2GB
Core Processor
Zynq UltraScale+ XCZU2CG-1SFVC784E
Module/Board Type
MPU Core
Flash Size
128MB
TE0803-03-2AE11-A Product Details
TE0803-03-2AE11-A Overview
The module or board type of the microcontroller is MPU Core.With Zynq UltraScale+ XCZU2CG-1SFVC784E cores, microprocessor chip is powered by a processor.The microcontroller is set to 0°C~85°C by default, which is the default setting.There is a 128MB size to the MCU electronics's flash.B2B is the connector type.The TE0803 Series is the group in which MCU chip belongs.This is 2GB in order to guarantee that the software runs normally.
TE0803-03-2AE11-A Features
Core processor of Zynq UltraScale+ XCZU2CG-1SFVC784E Flash size of 128MB
TE0803-03-2AE11-A Applications
There are a lot of Trenz Electronic GmbH TE0803-03-2AE11-A Microcontroller, Microprocessor, FPGA Modules applications.