TE0803-03-2BE11-A datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available on our website
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TE0803-03-2BE11-A Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Operating Temperature
0°C~85°C
Series
TE0803
Size / Dimension
2.05 x 2.99 52mmx76mm
Part Status
Active
Moisture Sensitivity Level (MSL)
Not Applicable
Connector Type
B2B
RAM Size
2GB
Core Processor
Zynq UltraScale+ XCZU2EG-1SFVC784E
Module/Board Type
MPU Core
Flash Size
128MB
TE0803-03-2BE11-A Product Details
TE0803-03-2BE11-A Overview
MPU Core is the module or board type of the microcontroller.With Zynq UltraScale+ XCZU2EG-1SFVC784E cores, the processor drives microprocessor chip.0°C~85°C is the default setting for the microcontroller.There is a flash size 128MB on the MCU electronics.Connector type B2B refers to the type of connector.I would say that MCU chip belongs to the TE0803 Series.A minimum RAM size of 2GB is set to enable the software to run normally.
TE0803-03-2BE11-A Features
Core processor of Zynq UltraScale+ XCZU2EG-1SFVC784E Flash size of 128MB
TE0803-03-2BE11-A Applications
There are a lot of Trenz Electronic GmbH TE0803-03-2BE11-A Microcontroller, Microprocessor, FPGA Modules applications.