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TE0803-03-3BE11-A

TE0803-03-3BE11-A

TE0803-03-3BE11-A

Trenz Electronic GmbH

MPU Core Zynq UltraScale+ XCZU3EG-1SFVC784E 2.05 x 2.99 52mmx76mm 0°C~85°C 128MB B2B TE0803 2GB

SOT-23

TE0803-03-3BE11-A Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 12 Weeks
Operating Temperature 0°C~85°C
Series TE0803
Size / Dimension 2.05 x 2.99 52mmx76mm
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Connector Type B2B
RAM Size 2GB
Core Processor Zynq UltraScale+ XCZU3EG-1SFVC784E
Module/Board Type MPU Core
Flash Size 128MB
TE0803-03-3BE11-A Product Details

TE0803-03-3BE11-A Overview


Microcontroller MPU Core is a module or board.A Zynq UltraScale+ XCZU3EG-1SFVC784E-core processor drives microprocessor chip.Default settings for the microcontroller are 0°C~85°C.128MB is the size of the flash on the MCU electronics.The connector type is B2B.TE0803-Series.The RAM is reduced to 2GB in order to ensure that the software is able to run normally.

TE0803-03-3BE11-A Features


Core processor of Zynq UltraScale+ XCZU3EG-1SFVC784E
Flash size of 128MB


TE0803-03-3BE11-A Applications


There are a lot of Trenz Electronic GmbH
TE0803-03-3BE11-A Microcontroller, Microprocessor, FPGA Modules applications.


  • Industrial Instrumentation
  • Embedded Control Processing
  • Embedded User Interfaces
  • Test and Measurement
  • Medical Devices
  • Data Acquisition
  • Industrial Control
  • Process Control
  • Process Monitoring
  • Healthcare Monitoring

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