TE0803-03-4AE11-A datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available on our website
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TE0803-03-4AE11-A Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Operating Temperature
0°C~85°C
Series
TE0803
Size / Dimension
2.05 x 2.99 52mmx76mm
Part Status
Active
Moisture Sensitivity Level (MSL)
Not Applicable
Connector Type
B2B
RAM Size
2GB
Core Processor
Zynq UltraScale+ XCZU4CG-1SFVC784E
Module/Board Type
MPU Core
Flash Size
128MB
TE0803-03-4AE11-A Product Details
TE0803-03-4AE11-A Overview
Module or board type MPU Core describes the microcontroller.There are Zynq UltraScale+ XCZU4CG-1SFVC784E cores in its processor, which is what powers the microcontroller.It is default for the microcontroller to set the mode to 0°C~85°C.The size of the flash on the MCU electronics is 128MB.Connector type B2B refers to the type of connector.The MCUs is part of the TE0803 Series of products.As a precaution for ensuring that the software runs normally, the RAM size of the computer has been reduced to 2GB.
TE0803-03-4AE11-A Features
Core processor of Zynq UltraScale+ XCZU4CG-1SFVC784E Flash size of 128MB
TE0803-03-4AE11-A Applications
There are a lot of Trenz Electronic GmbH TE0803-03-4AE11-A Microcontroller, Microprocessor, FPGA Modules applications.