TE0803-03-4DE11-A datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available on our website
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TE0803-03-4DE11-A Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Operating Temperature
0°C~85°C
Series
TE0803
Size / Dimension
2.05 x 2.99 52mmx76mm
Part Status
Active
Moisture Sensitivity Level (MSL)
Not Applicable
Connector Type
B2B
RAM Size
2GB
Core Processor
Zynq UltraScale+ XCZU4EV-1SFVC784E
Module/Board Type
MPU Core
Flash Size
128MB
TE0803-03-4DE11-A Product Details
TE0803-03-4DE11-A Overview
A MPU Core-type board or module is used in this microcontroller.There are Zynq UltraScale+ XCZU4EV-1SFVC784E cores in the processor.In order to use the microcontroller, the default setting is 0°C~85°C.A MCU electronics's flash size is measured by the letter 128MB.An B2B connector has a B2B connector type.The MCUs is part of the TE0803 Series of products.The RAM size has been reduced to 2GB in order to ensure that the software runs normally.
TE0803-03-4DE11-A Features
Core processor of Zynq UltraScale+ XCZU4EV-1SFVC784E Flash size of 128MB
TE0803-03-4DE11-A Applications
There are a lot of Trenz Electronic GmbH TE0803-03-4DE11-A Microcontroller, Microprocessor, FPGA Modules applications.