TE0808-04-09EG-1EE datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available on our website
SOT-23
TE0808-04-09EG-1EE Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Operating Temperature
0°C~85°C
Series
TE0808
Size / Dimension
2.05 x 2.99 52mmx76mm
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Connector Type
B2B
RAM Size
4GB
Core Processor
Zynq UltraScale+ XCZU9EG-1FFVC900E
Module/Board Type
MPU Core
Flash Size
128MB
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$1,275.01000
$1
TE0808-04-09EG-1EE Product Details
TE0808-04-09EG-1EE Overview
A MPU Core module or board is used in the microcontroller.Microprocessor chip is powered by a processor with a total of Zynq UltraScale+ XCZU9EG-1FFVC900E cores in it.0°C~85°C is the default setting for the microcontroller.128MB is the size of the flash on the MCU electronics.In this case, the connector type is B2B.There are two versions of this microcontrollers in the TE0808 Series.The RAM size has been reduced to 4GB in order to ensure that the software runs normally.
TE0808-04-09EG-1EE Features
Core processor of Zynq UltraScale+ XCZU9EG-1FFVC900E Flash size of 128MB
TE0808-04-09EG-1EE Applications
There are a lot of Trenz Electronic GmbH TE0808-04-09EG-1EE Microcontroller, Microprocessor, FPGA Modules applications.