TE0808-04-09EG-2IE datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available on our website
SOT-23
TE0808-04-09EG-2IE Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
14 Weeks
Operating Temperature
-40°C~85°C
Series
TE0808
Size / Dimension
2.05 x 2.99 52mmx76mm
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Connector Type
B2B
RAM Size
4GB
Core Processor
Zynq UltraScale+ XCZU9EG-1FFVC900E
Module/Board Type
MPU Core
Flash Size
128MB
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$2,377.62000
$2
TE0808-04-09EG-2IE Product Details
TE0808-04-09EG-2IE Overview
A MPU Core module or board is used in the microcontroller.A Zynq UltraScale+ XCZU9EG-1FFVC900E-core processor drives microprocessor chip.It is default for the microcontroller to set the mode to -40°C~85°C.There is a flash size 128MB on the MCU electronics.In this case, the connector type is B2B.A member of the TE0808 Series, this MCUs can be found in this category.This is 4GB in order to guarantee that the software runs normally.
TE0808-04-09EG-2IE Features
Core processor of Zynq UltraScale+ XCZU9EG-1FFVC900E Flash size of 128MB
TE0808-04-09EG-2IE Applications
There are a lot of Trenz Electronic GmbH TE0808-04-09EG-2IE Microcontroller, Microprocessor, FPGA Modules applications.