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TE0808-04-09EG-2IE

TE0808-04-09EG-2IE

TE0808-04-09EG-2IE

Trenz Electronic GmbH

TE0808-04-09EG-2IE datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available on our website

SOT-23

TE0808-04-09EG-2IE Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 14 Weeks
Operating Temperature -40°C~85°C
Series TE0808
Size / Dimension 2.05 x 2.99 52mmx76mm
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Connector Type B2B
RAM Size 4GB
Core Processor Zynq UltraScale+ XCZU9EG-1FFVC900E
Module/Board Type MPU Core
Flash Size 128MB
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $2,377.62000 $2
TE0808-04-09EG-2IE Product Details

TE0808-04-09EG-2IE Overview


A MPU Core module or board is used in the microcontroller.A Zynq UltraScale+ XCZU9EG-1FFVC900E-core processor drives microprocessor chip.It is default for the microcontroller to set the mode to -40°C~85°C.There is a flash size 128MB on the MCU electronics.In this case, the connector type is B2B.A member of the TE0808 Series, this MCUs can be found in this category.This is 4GB in order to guarantee that the software runs normally.

TE0808-04-09EG-2IE Features


Core processor of Zynq UltraScale+ XCZU9EG-1FFVC900E
Flash size of 128MB

TE0808-04-09EG-2IE Applications


There are a lot of Trenz Electronic GmbH TE0808-04-09EG-2IE Microcontroller, Microprocessor, FPGA Modules applications.

  • Thermostat
  • Portable Data Terminals
  • Bar Code Scanners
  • Process Control
  • Power Protection Systems
  • Test and Measurement
  • Human Machine Control Panel
  • Embedded User Interfaces
  • Patient Monitoring
  • Industrial Control

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