TE0808-04-15EG-1EE datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available on our website
SOT-23
TE0808-04-15EG-1EE Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
14 Weeks
Operating Temperature
0°C~85°C
Series
TE0808
Size / Dimension
2.05 x 2.99 52mmx76mm
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
Not Applicable
Connector Type
B2B
RAM Size
2GB
Core Processor
Zynq UltraScale+ XCZU15EG-1FFVC900E
Module/Board Type
MPU Core
Flash Size
128MB
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$1,693.21000
$1
TE0808-04-15EG-1EE Product Details
TE0808-04-15EG-1EE Overview
Microcontroller MPU Core is a module or board.With Zynq UltraScale+ XCZU15EG-1FFVC900E cores, microprocessor chip is powered by a processor.It is default for the microcontroller to set the mode to 0°C~85°C.The MCU electronics's size of flash is 128MB.Connector type B2B refers to the type of connector.I would say that MCU chip belongs to the TE0808 Series.This is 2GB in order to guarantee that the software runs normally.
TE0808-04-15EG-1EE Features
Core processor of Zynq UltraScale+ XCZU15EG-1FFVC900E Flash size of 128MB
TE0808-04-15EG-1EE Applications
There are a lot of Trenz Electronic GmbH TE0808-04-15EG-1EE Microcontroller, Microprocessor, FPGA Modules applications.