TE0808-04-15EG-1EK datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available on our website
SOT-23
TE0808-04-15EG-1EK Datasheet
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Specifications
Name
Value
Type
Parameter
Operating Temperature
0°C~85°C
Series
TE0808
Size / Dimension
2.05 x 2.99 52mmx76mm
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Connector Type
B2B
RAM Size
4GB
Core Processor
Zynq UltraScale+ XCZU15EG-1FFVC900E
Module/Board Type
MPU Core
Flash Size
128MB
RoHS Status
ROHS3 Compliant
TE0808-04-15EG-1EK Product Details
TE0808-04-15EG-1EK Overview
Module or board type MPU Core describes the microcontroller.Microprocessor chip is driven by a processor with Zynq UltraScale+ XCZU15EG-1FFVC900E cores.It is not surprising that 0°C~85°C is the microcontroller's default setting.There is a 128MB size to the MCU electronics's flash.B2B is the connector type.MCU chip belongs to the TE0808 Series.Software runs normally with RAM size 4GB when the RAM size is reduced.
TE0808-04-15EG-1EK Features
Core processor of Zynq UltraScale+ XCZU15EG-1FFVC900E Flash size of 128MB
TE0808-04-15EG-1EK Applications
There are a lot of Trenz Electronic GmbH TE0808-04-15EG-1EK Microcontroller, Microprocessor, FPGA Modules applications.