TE0808-04-9GI21-AS datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available on our website
SOT-23
TE0808-04-9GI21-AS Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
14 Weeks
Operating Temperature
-40°C~85°C
Series
TE0808
Size / Dimension
2.05 x 2.99 52mmx76mm
Part Status
Active
Moisture Sensitivity Level (MSL)
Not Applicable
Connector Type
B2B
RAM Size
4GB
Core Processor
Zynq UltraScale+ ZU9
Module/Board Type
FPGA Core
Flash Size
128MB
RoHS Status
ROHS3 Compliant
TE0808-04-9GI21-AS Product Details
TE0808-04-9GI21-AS Overview
In this case, the module or board type of the microcontroller is FPGA Core.There are Zynq UltraScale+ ZU9 cores in the processor.It is important to note that the microcontroller is set to -40°C~85°C as the default setting.Flash size on this MCU electronics is 128MB.Microprocessor chip is a type B2B connector.The TE0808 Series is the group in which MCU chip belongs.To ensure that the software runs normally, the RAM size is reduced to 4GB.
TE0808-04-9GI21-AS Features
Core processor of Zynq UltraScale+ ZU9 Flash size of 128MB
TE0808-04-9GI21-AS Applications
There are a lot of Trenz Electronic GmbH TE0808-04-9GI21-AS Microcontroller, Microprocessor, FPGA Modules applications.