TE0820-02-03EG-1EA datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available on our website
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TE0820-02-03EG-1EA Datasheet
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Specifications
Name
Value
Type
Parameter
Operating Temperature
0°C~85°C
Series
TE0820
Size / Dimension
1.97 x 1.57 50mmx40mm
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
Not Applicable
Connector Type
B2B
RAM Size
1GB
Core Processor
Zynq UltraScale+ XCZU3EG-1SFVC784E
Module/Board Type
MPU Core
Flash Size
128MB
TE0820-02-03EG-1EA Product Details
TE0820-02-03EG-1EA Overview
Module or board type MPU Core describes the microcontroller.An integral MCU electronics of it is a processor with Zynq UltraScale+ XCZU3EG-1SFVC784E cores that drives the whole thing.The microcontroller is set to 0°C~85°C by default, which is the default setting.The size of the flash on the MCU electronics is 128MB.Microprocessor chip is a type B2B connector.I would say that MCU chip belongs to the TE0820 Series.A minimum RAM size of 1GB is set to enable the software to run normally.
TE0820-02-03EG-1EA Features
Core processor of Zynq UltraScale+ XCZU3EG-1SFVC784E Flash size of 128MB
TE0820-02-03EG-1EA Applications
There are a lot of Trenz Electronic GmbH TE0820-02-03EG-1EA Microcontroller, Microprocessor, FPGA Modules applications.