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TE0820-02-03EG-1EA

TE0820-02-03EG-1EA

TE0820-02-03EG-1EA

Trenz Electronic GmbH

TE0820-02-03EG-1EA datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available on our website

SOT-23

TE0820-02-03EG-1EA Datasheet

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Specifications
Name Value
Type Parameter
Operating Temperature 0°C~85°C
Series TE0820
Size / Dimension 1.97 x 1.57 50mmx40mm
Part Status Obsolete
Moisture Sensitivity Level (MSL) Not Applicable
Connector Type B2B
RAM Size 1GB
Core Processor Zynq UltraScale+ XCZU3EG-1SFVC784E
Module/Board Type MPU Core
Flash Size 128MB
TE0820-02-03EG-1EA Product Details

TE0820-02-03EG-1EA Overview


Module or board type MPU Core describes the microcontroller.An integral MCU electronics of it is a processor with Zynq UltraScale+ XCZU3EG-1SFVC784E cores that drives the whole thing.The microcontroller is set to 0°C~85°C by default, which is the default setting.The size of the flash on the MCU electronics is 128MB.Microprocessor chip is a type B2B connector.I would say that MCU chip belongs to the TE0820 Series.A minimum RAM size of 1GB is set to enable the software to run normally.

TE0820-02-03EG-1EA Features


Core processor of Zynq UltraScale+ XCZU3EG-1SFVC784E
Flash size of 128MB

TE0820-02-03EG-1EA Applications


There are a lot of Trenz Electronic GmbH TE0820-02-03EG-1EA Microcontroller, Microprocessor, FPGA Modules applications.

  • Data Acquisition
  • Medical Devices
  • Network Enabled Data Acquisition
  • Process Monitoring
  • Human Machine Interface
  • Industrial Instrumentation
  • Software Defined Radio
  • Patient Monitoring
  • Test and Measurement
  • Power Protection Systems

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