TE0820-03-02EG-1ED datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available on our website
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TE0820-03-02EG-1ED Datasheet
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Specifications
Name
Value
Type
Parameter
Operating Temperature
0°C~85°C
Series
TE0820
Size / Dimension
1.57 x 1.97 40mmx50mm
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
Not Applicable
Connector Type
B2B
RAM Size
2GB
Core Processor
Zynq UltraScale+ XCZU2EG-1SFVC784E
Module/Board Type
MPU Core
Flash Size
128MB
TE0820-03-02EG-1ED Product Details
TE0820-03-02EG-1ED Overview
The module or board type of the microcontroller is MPU Core.There are Zynq UltraScale+ XCZU2EG-1SFVC784E cores in the processor.The microcontroller is set to 0°C~85°C by default, which is the default setting.The MCU electronics's size of flash is 128MB.Connector type B2B refers to the type of connector.In the TE0820 series, this is one of the microcontrollers.The RAM size has been reduced to 2GB in order to ensure that the software runs normally.
TE0820-03-02EG-1ED Features
Core processor of Zynq UltraScale+ XCZU2EG-1SFVC784E Flash size of 128MB
TE0820-03-02EG-1ED Applications
There are a lot of Trenz Electronic GmbH TE0820-03-02EG-1ED Microcontroller, Microprocessor, FPGA Modules applications.