TE0820-03-03EG-1EA datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available on our website
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TE0820-03-03EG-1EA Datasheet
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Specifications
Name
Value
Type
Parameter
Operating Temperature
0°C~80°C
Series
TE0820
Size / Dimension
1.57 x 1.97 40mmx50mm
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
Not Applicable
Connector Type
B2B
RAM Size
2GB
Core Processor
Zynq UltraScale+ XCZU3EG-1SFVC784E
Module/Board Type
MPU Core
Flash Size
128MB
TE0820-03-03EG-1EA Product Details
TE0820-03-03EG-1EA Overview
A MPU Core module or board is used in the microcontroller.It has Zynq UltraScale+ XCZU3EG-1SFVC784E cores and is driven by a processor.In order to use the microcontroller, the default setting is 0°C~80°C.128MB is the size of the flash on the MCU electronics.Connectors of type B2B are the most common.The TE0820 Series is the group in which MCU chip belongs.A RAM size of 2GB is set in order to ensure that the software runs normally and that MCU chip does not crash.
TE0820-03-03EG-1EA Features
Core processor of Zynq UltraScale+ XCZU3EG-1SFVC784E Flash size of 128MB
TE0820-03-03EG-1EA Applications
There are a lot of Trenz Electronic GmbH TE0820-03-03EG-1EA Microcontroller, Microprocessor, FPGA Modules applications.