TE0820-03-03EG-1ED datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available on our website
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TE0820-03-03EG-1ED Datasheet
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Specifications
Name
Value
Type
Parameter
Operating Temperature
0°C~80°C
Series
TE0820
Size / Dimension
1.57 x 1.97 40mmx50mm
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
Not Applicable
Connector Type
B2B
RAM Size
2GB
Core Processor
Zynq UltraScale+ XCZU3EG-1SFVC784E
Module/Board Type
MPU Core
Flash Size
128MB
TE0820-03-03EG-1ED Product Details
TE0820-03-03EG-1ED Overview
MPU Core is the type of module or board that is used in this microcontroller.With Zynq UltraScale+ XCZU3EG-1SFVC784E cores, the processor drives microprocessor chip.It is default for the microcontroller to set the mode to 0°C~80°C.MCU chips flash size is 128MB.Microprocessor chip is a type B2B connector.In the TE0820 series, this is one of the microcontrollers.The RAM is reduced to 2GB in order to ensure that the software is able to run normally.
TE0820-03-03EG-1ED Features
Core processor of Zynq UltraScale+ XCZU3EG-1SFVC784E Flash size of 128MB
TE0820-03-03EG-1ED Applications
There are a lot of Trenz Electronic GmbH TE0820-03-03EG-1ED Microcontroller, Microprocessor, FPGA Modules applications.