TE0820-03-03EG-1EL datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available on our website
SOT-23
TE0820-03-03EG-1EL Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Operating Temperature
0°C~85°C
Series
TE0820
Size / Dimension
1.57 x 1.97 40mmx50mm
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Connector Type
B2B
RAM Size
2GB
Core Processor
Zynq UltraScale+ XCZU3EG-1SFVC784E
Module/Board Type
MPU Core
Flash Size
128MB
TE0820-03-03EG-1EL Product Details
TE0820-03-03EG-1EL Overview
The microcontroller has been classified as a MPU Core type module or board.It has Zynq UltraScale+ XCZU3EG-1SFVC784E cores and is driven by a processor.0°C~85°C is the default setting for the microcontroller.The size of the flash on the MCU electronics is 128MB.An B2B connector has a B2B connector type.The TE0820 Series is the group in which MCU chip belongs.This is done to make sure that the software is able to run normally and that the RAM size is reduced to 2GB.
TE0820-03-03EG-1EL Features
Core processor of Zynq UltraScale+ XCZU3EG-1SFVC784E Flash size of 128MB
TE0820-03-03EG-1EL Applications
There are a lot of Trenz Electronic GmbH TE0820-03-03EG-1EL Microcontroller, Microprocessor, FPGA Modules applications.