TE0841-01-040-1I datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available on our website
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TE0841-01-040-1I Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Operating Temperature
-40°C~85°C
Published
2012
Series
TE0841
Size / Dimension
1.97 x 1.57 50mmx40mm
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
Not Applicable
Connector Type
Samtec LSHM
RAM Size
4GB
Core Processor
Kintex UltraScale KU40
Module/Board Type
FPGA Core
Flash Size
32MB
TE0841-01-040-1I Product Details
TE0841-01-040-1I Overview
Module or board type FPGA Core describes the microcontroller.Microprocessor chip is driven by a processor with Kintex UltraScale KU40 cores.Microcontrollers are configured by default to -40°C~85°C.The MCU electronics's size of flash is 32MB.The connector type is Samtec LSHM.A member of the TE0841 Series, this MCUs can be found in this category.As a result, the RAM size of the software has been reduced to 4GB in order to ensure that MCU chip runs normally.
TE0841-01-040-1I Features
Core processor of Kintex UltraScale KU40 Flash size of 32MB
TE0841-01-040-1I Applications
There are a lot of Trenz Electronic GmbH TE0841-01-040-1I Microcontroller, Microprocessor, FPGA Modules applications.