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TE0890-01-25-1C

TE0890-01-25-1C

TE0890-01-25-1C

Trenz Electronic GmbH

TE0890-01-25-1C datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available on our website

SOT-23

TE0890-01-25-1C Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 12 Weeks
Operating Temperature 0°C~70°C
Series TE0890
Size / Dimension 1.06 x 2.05 27.0mmx52.0mm
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Connector Type Dual-pinout DIP-40 or 50mil 80 pin connector
Speed 100MHz
Core Processor Xilinx Spartan-7 XC7S25
Module/Board Type FPGA Core
Flash Size 64Mbit
RoHS Status ROHS3 Compliant
TE0890-01-25-1C Product Details

TE0890-01-25-1C Overview


FPGA Core is the module or board type of the microcontroller.There are Xilinx Spartan-7 XC7S25 cores in its processor, which is what powers the microcontroller.It is important to note that the microcontroller is set to 0°C~70°C as the default setting.There is a flash size 64Mbit on the MCU electronics.Microprocessor chip is a type Dual-pinout DIP-40 or 50mil 80 pin connector connector.This MCUs belongs to the TE0890 Series of MCUs.100MHz speed is used by the MCU chip.

TE0890-01-25-1C Features


Core processor of Xilinx Spartan-7 XC7S25
Flash size of 64Mbit
Speed of 100MHz

TE0890-01-25-1C Applications


There are a lot of Trenz Electronic GmbH TE0890-01-25-1C Microcontroller, Microprocessor, FPGA Modules applications.

  • Network Enabled Data Acquisition
  • Medical Devices
  • Embedded User Interfaces
  • Software Defined Radio
  • Healthcare Monitoring
  • Industrial Automation
  • Human Machine Control Panel
  • Process Control
  • Data Acquisition
  • IoT Secure Gateways

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