TE0890-01-25-1C datasheet pdf and Embedded - Microcontroller, Microprocessor, FPGA Modules product details from Trenz Electronic GmbH stock available on our website
SOT-23
TE0890-01-25-1C Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Operating Temperature
0°C~70°C
Series
TE0890
Size / Dimension
1.06 x 2.05 27.0mmx52.0mm
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Connector Type
Dual-pinout DIP-40 or 50mil 80 pin connector
Speed
100MHz
Core Processor
Xilinx Spartan-7 XC7S25
Module/Board Type
FPGA Core
Flash Size
64Mbit
RoHS Status
ROHS3 Compliant
TE0890-01-25-1C Product Details
TE0890-01-25-1C Overview
FPGA Core is the module or board type of the microcontroller.There are Xilinx Spartan-7 XC7S25 cores in its processor, which is what powers the microcontroller.It is important to note that the microcontroller is set to 0°C~70°C as the default setting.There is a flash size 64Mbit on the MCU electronics.Microprocessor chip is a type Dual-pinout DIP-40 or 50mil 80 pin connector connector.This MCUs belongs to the TE0890 Series of MCUs.100MHz speed is used by the MCU chip.
TE0890-01-25-1C Features
Core processor of Xilinx Spartan-7 XC7S25 Flash size of 64Mbit Speed of 100MHz
TE0890-01-25-1C Applications
There are a lot of Trenz Electronic GmbH TE0890-01-25-1C Microcontroller, Microprocessor, FPGA Modules applications.