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BFC233922684

  • BFC233922684 - MKP339 0.68μF Film Capacitor ±20% Radial PC Pins 630V-DC 310V-AC Polypropylene (PP), Metallized Through Hole
  • BFC233922684 - MKP339 0.68μF Film Capacitor ±20% Radial PC Pins 630V-DC 310V-AC Polypropylene (PP), Metallized Through Hole

BFC233922684

BFC233922684

Vishay BC Components

MKP339 0.68μF Film Capacitor ±20% Radial PC Pins 630V-DC 310V-AC Polypropylene (PP), Metallized Through Hole

SOT-23

BFC233922684 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 15 Weeks
Contact PlatingTin
Mount Through Hole
Mounting Type Through Hole
Package / Case Radial
Terminal Shape WIRE
Dielectric MaterialPolypropylene (PP), Metallized
Weight 5.500006g
Operating Temperature-55°C~110°C
PackagingBulk
Published 2007
Series MKP339
Size / Dimension 1.024Lx0.335W 26.00mmx8.50mm
Tolerance ±20%
JESD-609 Code e3
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
Termination PC Pins
ECCN Code EAR99
Applications Automotive; EMI, RFI Suppression
Additional FeatureIEC60384-14
HTS Code8532.25.00.70
Capacitance 0.68μF
Voltage - Rated DC 630V
Depth 8.5mm
Voltage - Rated AC 310V
Lead Pitch 22.5mm
Capacitor Type FILM CAPACITOR
Dielectric PP
Lead Spacing0.886 22.50mm
Lead Diameter 800 μm
Height 8.5mm
Height Seated (Max) 0.709 18.00mm
Length 26mm
Radiation HardeningNo
RoHS StatusROHS3 Compliant
Lead Free Lead Free
Ratings AEC-Q200, X2
In-Stock:3165 items

Pricing & Ordering

QuantityUnit PriceExt. Price
200$2.04750$409.5

BFC233922684 Product Details

BFC233922684 Overview


Its lead spacing is 0.886 22.50mm.-55°C~110°C is the maximum temperature at which the device can operate.

BFC233922684 Features



BFC233922684 Applications


There are a lot of Vishay BC Components BFC233922684 applications of film capacitors.

  • IGBT
  • Global positioning systems
  • Battery management system
  • Switch-mode power supplies
  • Coupling, decoupling
  • RF Modules
  • Audio/video equipment
  • Filtering
  • Electronic ballasts
  • Mobile communications

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