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MSP1BR3900GR10E3

MSP1BR3900GR10E3

MSP1BR3900GR10E3

Vishay Sfernice

Res Wirewound 0.39 Ohm 2% 1W ±100ppm/C Molded J-Lead SMD

SOT-23

MSP1BR3900GR10E3 Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 8 Weeks
Contact PlatingTin
Package / Case Molded
PackagingTape & Reel (TR)
Published 2016
Tolerance 2%
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination J-Lead
Temperature Coefficient100 ppm/°C
Resistance 390mOhm
Max Operating Temperature275°C
Min Operating Temperature -55°C
Composition Wirewound
Power Rating 1W
Depth 3.8mm
Military Standard Not
Length 6.9mm
Radiation HardeningNo
RoHS StatusROHS3 Compliant
In-Stock:1104 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$5.90000$5.9
500$5.841$2920.5
1000$5.782$5782
1500$5.723$8584.5
2000$5.664$11328
2500$5.605$14012.5

About MSP1BR3900GR10E3

The MSP1BR3900GR10E3 from Vishay Sfernice is a high-performance microcontroller designed for a wide range of embedded applications. This component features Res Wirewound 0.39 Ohm 2% 1W ±100ppm/C Molded J-Lead SMD.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the MSP1BR3900GR10E3, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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