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SI9707DY-E3

SI9707DY-E3

SI9707DY-E3

Vishay / Siliconix

Tape & Reel (TR) Hot Swap Controllers SOIC

SOT-23

SI9707DY-E3 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mount Surface Mount
Package / Case SOIC
Packaging Tape & Reel (TR)
JESD-609 Code e3
Pbfree Code yes
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 16
Terminal Finish Matte Tin (Sn)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 5V
Time@Peak Reflow Temperature-Max (s) 40
Pin Count 16
JESD-30 Code R-PDSO-G16
Number of Outputs 2
Supply Voltage-Max (Vsup) 5.5V
Power Supplies 3.3/5V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 4.5V
Analog IC - Other Type ANALOG CIRCUIT
Length 9.9mm
Height Seated (Max) 1.75mm
Width 3.9mm
Radiation Hardening No
RoHS Status RoHS Compliant
SI9707DY-E3 Product Details

SI9707DY-E3 Overview


The SOIC package contains it.There is a Tape & Reel (TR)-shaped package for it.There are 16 terminations in total.This device has a terminal position of DUAL.16 pins make up its total.High efficiency can be achieved when the supply voltage is 5V.Surface Mount is its direction of movement.Hot-swappable device is stable to operate at a temperature of 85°C°C at the maximum.Hot-swappable device works at a minimum temperature of -40°C degrees Celsius to maintain reliabilHot-swappable devicey.In order for a device to operate normally, the supply voltage (Vsup) must be higher than 4.5V.There is a value of 5.5V set for Vsup (maximum supply voltage).Hot-swappable device has a 3.3/5V power supply, which is the power supply used in the part.There is a ANALOG CIRCUIT IC in this gadget, which is an analog IC.The default setting is output 2.

SI9707DY-E3 Features


The terminal position of 16


SI9707DY-E3 Applications


There are a lot of Vishay / Siliconix
SI9707DY-E3 hot swap controllers applications.


  • Telecommunications
  • Industrial
  • Datacom
  • Electric vehicle
  • Avionics systems
  • Safe board insertion and extraction
  • Industrial computers and servers
  • Redundant-array-of-independent-disk (RAID) storage
  • Other forms of communications infrastructure
  • Board or blade insertion into live backplanes

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