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1869430000

1869430000

1869430000

Weidmüller

0.150 3.81mm Black Tube Liquid Crystal Polymer (LCP), Glass Filled Through Hole Horizontal with Board Screwless - Push Button Clamp 1 Levels 16-24 AWG Omnimate LSF-SMT

SOT-23

1869430000 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 12 Weeks
Contact Plating Tin
Mount Through Hole
Mounting Type Through Hole
Housing Material Liquid Crystal Polymer (LCP), Glass Filled
Contact Material - Plating Copper Alloy - Tin Plated
Operating Temperature -50°C~240°C
Packaging Tube
Series Omnimate LSF-SMT
Published 2004
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Screwless
Color Black
Number of Rows 1
Voltage - Rated 300V
Pitch 0.150 3.81mm
Orientation Right Angle
Current Rating 10A
Approval Agency CSA, cURus
Number of Contacts 9
Wire Gauge 16-24 AWG
Number of Levels 1
Current 12A
Wire Gauge (Max) 24 AWG
Wire Gauge (Min) 16 AWG
Number of Decks 1
Terminal and Terminal Block Type MODULAR TERMINAL BLOCK
Number of Ways 9
Safety Approval UL; VDE; CSA
Mating Orientation Horizontal with Board
Wire Termination Screwless - Push Button Clamp
Hole Diameter 1.1 mm
Stripping Length 8mm
Fastening Method PUSH-ON
Radiation Hardening No
RoHS Status RoHS Compliant
Flammability Rating UL94 V-0
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $4.30000 $4.3
15 $3.27533 $49.12995
30 $3.06800 $92.04
60 $2.72717 $163.6302
105 $2.66800 $280.14
255 $2.46047 $627.41985
510 $2.22329 $1133.8779
1,005 $1.97132 $1.97132
5,010 $1.85275 $9.26375
1869430000 Product Details

1869430000 Overview


There is a mounting type of Through Hole for this device.It is necessary to use a Tube case for packaging the product.This product is part of the Omnimate LSF-SMT Series.Through Hole is used to mount the part.In this case, the device operates at -50°C~240°C Operating Temperature.

1869430000 Features


Omnimate LSF-SMT series


1869430000 Applications


There are a lot of Weidmüller
1869430000 Terminal Blocks applications.


  • Transportation
  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications

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