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1885700000

1885700000

1885700000

Weidmüller

0.138 3.50mm Black Tube Liquid Crystal Polymer (LCP), Glass Filled Through Hole 45° (135°) Angle with Board Screwless - Push Button Clamp 1 Levels 16-24 AWG Omnimate LSF-SMT

SOT-23

1885700000 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 12 Weeks
Contact Plating Tin
Mount Through Hole
Mounting Type Through Hole
Housing Material Liquid Crystal Polymer (LCP), Glass Filled
Contact Material - Plating Copper Alloy - Tin Plated
Operating Temperature -50°C~240°C
Packaging Tube
Series Omnimate LSF-SMT
Published 2005
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Screwless
ECCN Code EAR99
Color Black
Number of Rows 1
Voltage - Rated 300V
Additional Feature LCP GF, 94V-0
HTS Code 8536.69.40.40
Pitch 0.138 3.50mm
Current Rating 10A
Approval Agency CSA, cURus
Number of Contacts 7
Wire Gauge 16-24 AWG
Number of Levels 1
Current 12A
Wire Gauge (Max) 24 AWG
Wire Gauge (Min) 16 AWG
Number of Decks 1
Terminal and Terminal Block Type MODULAR TERMINAL BLOCK
Number of Ways 7
Safety Approval UL; CSA
Mating Orientation 45° (135°) Angle with Board
Wire Termination Screwless - Push Button Clamp
Hole Diameter 1.1 mm
Stripping Length 8mm
Fastening Method PUSH-ON
Radiation Hardening No
RoHS Status RoHS Compliant
Flammability Rating UL94 V-0
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $3.24000 $3.24
21 $2.46619 $51.78999
42 $2.31024 $97.03008
63 $2.05349 $129.36987
105 $2.00876 $210.9198
252 $1.85258 $466.85016
504 $1.67401 $843.70104
1885700000 Product Details

1885700000 Overview


Through Hole is the type of mounting for the device.To package the product, a Tube case is used.The product is a member of the Omnimate LSF-SMT Series.Among other features are LCP GF, 94V-0, to name only a few.It is mounted by Through Hole.It operates at an operating temperature of -50°C~240°C.

1885700000 Features


Omnimate LSF-SMT series


1885700000 Applications


There are a lot of Weidmüller
1885700000 Terminal Blocks applications.


  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications
  • Data Technology

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