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W25Q32FVDAIG TR

W25Q32FVDAIG TR

W25Q32FVDAIG TR

Winbond Electronics

SpiFlash? Memory IC SpiFlash? Series

SOT-23

W25Q32FVDAIG TR Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Through Hole
Package / Case 8-DIP (0.300, 7.62mm)
Operating Temperature -40°C~85°C TA
Packaging Tape & Reel (TR)
Published 2016
Series SpiFlash®
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Technology FLASH - NOR
Voltage - Supply 2.7V~3.6V
Memory Size 32Mb 4M x 8
Memory Type Non-Volatile
Clock Frequency 104MHz
Memory Format FLASH
Memory Interface SPI - Quad I/O, QPI
Write Cycle Time - Word, Page 50μs, 3ms
RoHS Status ROHS3 Compliant
W25Q32FVDAIG TR Product Details

W25Q32FVDAIG TR Overview


In this case, the memory type of the device can be classified as Non-Volatile. In addition, memory ics is available in a Tape & Reel (TR) case as well. It is available in 8-DIP (0.300, 7.62mm) case. It is estimated that the memory size on the chip is 32Mb 4M x 8. The device uses a mainstream FLASH-format memory. A wide operating temperature range makes this device ideal for a variety of demanding applications. The device is capable of handling a supply voltage of 2.7V~3.6V. The recommended mounting type for memory ics is Through Hole. A clock frequency rotation within 104MHz is used for the ic memory chip to rotate data. Its target applications rely heavily on the SpiFlash? series memory devices.

W25Q32FVDAIG TR Features


Package / Case: 8-DIP (0.300, 7.62mm)

W25Q32FVDAIG TR Applications


There are a lot of Winbond Electronics W25Q32FVDAIG TR Memory applications.

  • eDRAM
  • networks
  • nonvolatile BIOS memory
  • personal computers
  • personal digital assistants
  • cell phones
  • multimedia computers
  • servers
  • Cache memory
  • telecommunications

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