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W632GG6KB15J

W632GG6KB15J

W632GG6KB15J

Winbond Electronics

Memory IC

SOT-23

W632GG6KB15J Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 96-TFBGA
Operating Temperature -40°C~105°C TC
Packaging Tray
Part Status Discontinued
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Technology SDRAM - DDR3
Voltage - Supply 1.425V~1.575V
Memory Size 2Gb 128M x 16
Memory Type Volatile
Clock Frequency 667MHz
Access Time 20ns
Memory Format DRAM
Memory Interface Parallel
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
W632GG6KB15J Product Details

W632GG6KB15J Overview


A Volatile-type memory can be classified as the memory type of this device. In addition, memory ics is available in a Tray case as well. An embedded 96-TFBGA case surrounds memory ics. On the chip, there is an 2Gb 128M x 16 memory, which is the size of the chip's memory. This device utilizes a DRAM format memory which is of mainstream design. -40°C~105°C TC is an extended operating temperature range, making this device ideal for demanding applications. It is supplied votage within 1.425V~1.575V. There is a recommendation that Surface Mount mounting type should be used for this product. A clock frequency rotation within 667MHz is used for the ic memory chip to rotate data.

W632GG6KB15J Features


Package / Case: 96-TFBGA

W632GG6KB15J Applications


There are a lot of Winbond Electronics W632GG6KB15J Memory applications.

  • nonvolatile BIOS memory
  • networking
  • main computer memory
  • multimedia computers
  • telecommunications
  • supercomputers
  • Cache memory
  • eDRAM
  • eSRAM
  • networks

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