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W632GG6MB-08

W632GG6MB-08

W632GG6MB-08

Winbond Electronics

Memory IC

SOT-23

W632GG6MB-08 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 96-VFBGA
Operating Temperature 0°C~95°C TC
Packaging Tray
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Technology SDRAM - DDR3
Voltage - Supply 1.425V~1.575V
Memory Size 2Gb 128M x 16
Memory Type Volatile
Memory Format DRAM
Memory Interface Parallel
RoHS Status ROHS3 Compliant
W632GG6MB-08 Product Details

W632GG6MB-08 Overview


There is a Volatile memory type associated with this device. There is a Tray case available. An embedded 96-VFBGA case surrounds memory ics. The memory size of the chip is 2Gb 128M x 16 Mb. Memory data is stored in DRAM-format, which is common in mainstream devices. Due to its extended operating temperature range, the device is well suited for a wide range of demanding applications. It is supplied votage within 1.425V~1.575V. It is recommended to mount it in the Surface Mount mounting type.

W632GG6MB-08 Features


Package / Case: 96-VFBGA

W632GG6MB-08 Applications


There are a lot of Winbond Electronics W632GG6MB-08 Memory applications.

  • personal digital assistants
  • supercomputers
  • hard disk drive (HDD)
  • networks
  • data buffer
  • mainframes
  • DVD disk buffer
  • personal computers
  • eDRAM
  • printers

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