XA3S700A-4FGG400Q Overview
There are two packages that contain fpga chips: BGA package and X package. The FIELD PROGRAMMABLE GATE ARRAY-series of FPGAs are composed of this type. Having 311 I/Os makes data transfers more coherent. Logic blocks consist of 13248 logic elements/cells. The supply voltage is 1.2V volts. In this case, the FPGA part belongs to the Field Programmable Gate Arrays family. This device is equipped with 248 separate outputs, which makes it a very versatile device. In total, it has 400 terminations on each end. This FPGA module has a RAM si45kBe of 45kB that is sufficient to make sure that the program is able to run normally. In this case, there are 400 pins on the board. Having stated that, if this FPGA is mounted in Surface Mount, then it may be able to perform fantastically according to its specifications. The 1.2V supply voltage provides designers with full flexibility in their designs. The device runs on a 1.21.2/3.33.3V battery and requires no additional power supply to operate. During its maximal operating temperature, this module reaches 125°C. In order to achieve -40°C, the operating temperature must be higher than -40°C. The building block that forms the basis of the system contains 700000 gates. This device has a pin count of 400 in fpga semiconductor. Fpga semiconductor consists of 1472 logic blocks (LABs). It usually uses a crystal oscillating at a frequency of 667MHz in order to do its work.
XA3S700A-4FGG400Q Features
311 I/Os
400 LABs/CLBs
125°C gates
1472 logic blocks (LABs)
XA3S700A-4FGG400Q Applications
There are a lot of Xilinx
XA3S700A-4FGG400Q FPGAs applications.
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
- Cryptography
- Filtering and communication encoding
- Aerospace and Defense
- Medical Electronics
- Audio
- Automotive
- Consumer Electronics