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XA3S700A-4FGG484I

XA3S700A-4FGG484I

XA3S700A-4FGG484I

Xilinx

1.2V V 2.6mm mm FPGAs FBGA 1mm mm 484

SOT-23

XA3S700A-4FGG484I Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mount Surface Mount
Package / Case FBGA
Number of Pins 484
JESD-609 Code e1
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484
ECCN Code 3A991.D
Max Operating Temperature100°C
Min Operating Temperature -40°C
Terminal Position BOTTOM
Terminal FormBALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 1.2V
Terminal Pitch1mm
Time@Peak Reflow Temperature-Max (s) 30
Pin Count484
Number of Outputs 288
Qualification StatusNot Qualified
Operating Supply Voltage1.2V
Supply Voltage-Max (Vsup) 1.26V
Power Supplies1.21.2/3.33.3V
Temperature GradeINDUSTRIAL
Number of I/O 372
RAM Size 45kB
Clock Frequency 667MHz
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 13248
Number of Gates700000
Screening Level AEC-Q100
Number of Logic Blocks (LABs) 1472
Speed Grade 4
Length 23mm
Height Seated (Max) 2.6mm
Width 23mm
RoHS StatusRoHS Compliant
In-Stock:1669 items

XA3S700A-4FGG484I Product Details

XA3S700A-4FGG484I Overview


This package is included in the FBGA package and is available for purchase. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. The I/Os are designed to facilitate a more coherent transfer of data. Logic elements/cells form the fundamental building block of a computer. 1.2V volts power it. With this device, you will be able to make use of 288 outputs. The total number of terminations is 484. During the configuration of this FPGA module, the RAM si45kBe reaches 45kB to ensure that the program runs normally. The device is designed with 484 pins in total. Fpga electronics is possible for this FPGA to perform as per fpga electronics s specifications as long as fpga electronics is mounted in Surface Mount direction. In the case of 1.2V supply voltage, designers can take full advantage of its flexibility. It is powered by a 1.21.2/3.33.3V battery, which can be purchased separately. In this module, 100°C is the maximum operating temperature at which fpga electronics can operate. Over -40°C, the operating temperature should be higher. Fpga semiconductor is made up of 700000 gates as fpga semiconductors basic building block. The device has a total of 484 pins on fpga semiconductor. In its basic building block, it is composed of 1472 logic blocks (LABs), which are called building blocks. A crystal oscillating at 667MHz is one of the most common components of this device.

XA3S700A-4FGG484I Features


372 I/Os
484 LABs/CLBs
100°C gates
1472 logic blocks (LABs)


XA3S700A-4FGG484I Applications


There are a lot of Xilinx
XA3S700A-4FGG484I FPGAs applications.


  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio

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