XC2S300E-7FGG456C Overview
Fpga chips is supplied in the FBGA package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is powered from a supply voltage of 1.8V. This FPGA part belongs to the family of Field Programmable Gate Arrays. There are 329 outputs incorporated in this device. Fpga chips is designed wFpga chipsh 456 terminations. The RAM si8kBe of this FPGA module reaches 8kB to ensure normal operation of the program. When operating with the supply voltage of 1.8V, designers can fully make use of its flexibility. The maximal operating temperature of this module reaches 85°C. The operating temperature should be higher than 0°C. Fpga semiconductor is equipped wfpga semiconductorh 456 pin count. Typically, fpga semiconductor uses a crystal oscillating at 400MHz . 1536 CLBs are basic modules used for its architecture. Fpga semiconductor incorporates 6912 logic cells used for the building block. Fpga semiconductor is also characteriMAXIMUM USABLE GATES = 300000ed by a feature called MAXIMUM USABLE GATES = 300000. 93000 equivalent gates are used for the design implement in the FPGA.
XC2S300E-7FGG456C Features
85°C gates
XC2S300E-7FGG456C Applications
There are a lot of Xilinx
XC2S300E-7FGG456C FPGAs applications.
- Digital signal processing
- Bioinformatics
- Device controllers
- Software-defined radio
- Random logic
- ASIC prototyping
- Medical imaging
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
