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XC3S1000L-4FG456C

XC3S1000L-4FG456C

XC3S1000L-4FG456C

Xilinx

2.6mm mm FPGAs FBGA 1mm mm 456

SOT-23

XC3S1000L-4FG456C Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Package / Case FBGA
Surface MountYES
JESD-609 Code e0
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 456
Terminal Finish Tin/Lead (Sn63Pb37)
HTS Code8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal FormBALL
Supply Voltage 1.2V
Terminal Pitch1mm
Reach Compliance Code not_compliant
Pin Count456
JESD-30 Code S-PBGA-B456
Number of Outputs 333
Qualification StatusNot Qualified
Operating Temperature (Max) 85°C
Power Supplies1.21.2/3.32.5V
Temperature GradeOTHER
Number of Inputs 333
Organization 1920 CLBS, 1000000 GATES
Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
Number of CLBs 1920
Number of Logic Cells17280
Number of Equivalent Gates 1000000
Length 23mm
Height Seated (Max) 2.6mm
Width 23mm
RoHS StatusNon-RoHS Compliant
In-Stock:2397 items

XC3S1000L-4FG456C Product Details

XC3S1000L-4FG456C Overview


In the package FBGA, this product is provided. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. Supply voltage is 1.2V volts. There is a Field Programmable Gate Arrays family component in this FPGA part. In this device, 333 outputs are incorporated in order to provide you with maximum flexibility. In total, the terminations of this piece are 456. This is a battery operated device that operates on 1.21.2/3.32.5V. I am going to present you with a device that is equipped with 456 pins. The architecture of the system is based on 1920 CLBs. It incorporates 17280 logic cells used for the building block. There are 1000000 equivalent gates implemented by the FPGA in order to implement the design. A maximum operating temperature of 85°C °C should be observed when running the equipment.

XC3S1000L-4FG456C Features




XC3S1000L-4FG456C Applications


There are a lot of Xilinx
XC3S1000L-4FG456C FPGAs applications.


  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio
  • Automotive
  • Consumer Electronics
  • Distributed Monetary Systems
  • Data Center

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