XC3S700A-5FG484C Overview

A FBGA package is provided with this component. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. This device features 372 I/Os in order to transfer data in a more efficient manner. A fundamental building block is made up of 13248 logic elements/cells. An electrical supply voltage of 1.2V powers it. A Field Programmable Gate Arrays-series FPGA part. In order to make this device as versatile as possible, there are 288 different outputs included. As a whole, it has 484 terminations. The FPGA module's RAM si45kBe reaches 45kB in order to ensure that the program operates in a normal manner. 484 pins are designed into the device. As long as this FPGA is mounted in Surface Mount, it should be able to function as it should in terms of its specifications, as well as its capabilities. A 1.2V-volt supply allows designers to fully utilize its flexibility. As far as the maximum operating temperature of this module is concerned, it reaches 85°C. Operating temperatures should exceed 0°C. Among its basic building blocks, there are 700000 gates that are included in it. In addition to this, it has 484 pins. 1472 logic blocks (LABs) make up its basic building blocks. Normally, fpga semiconductor uses an oscillator, which oscillates at 770MHz, to create the signal.

XC3S700A-5FG484C Features

372 I/Os
484 LABs/CLBs
85°C gates
1472 logic blocks (LABs)

XC3S700A-5FG484C Applications

There are a lot of Xilinx
XC3S700A-5FG484C FPGAs applications.

• Medical imaging
• Computer hardware emulation
• Integrating multiple SPLDs
• Voice recognition
• Cryptography
• Filtering and communication encoding
• Aerospace and Defense
• Medical Electronics
• Audio
• Automotive