XC3SD1800A-5FG676C Overview
There are two packages that contain fpga chips: BGA package and X package. The FIELD PROGRAMMABLE GATE ARRAY-series of FPGAs are composed of this type. Having 519 I/Os makes data transfers more coherent. Logic blocks consist of 37440 logic elements/cells. The supply voltage is 1.2V volts. In this case, the FPGA part belongs to the Field Programmable Gate Arrays family. This device is equipped with 409 separate outputs, which makes it a very versatile device. In total, it has 676 terminations on each end. This FPGA module has a RAM si189kBe of 189kB that is sufficient to make sure that the program is able to run normally. In this case, there are 676 pins on the board. Having stated that, if this FPGA is mounted in Surface Mount, then it may be able to perform fantastically according to its specifications. The 1.2V supply voltage provides designers with full flexibility in their designs. During its maximal operating temperature, this module reaches 85°C. In order to achieve 0°C, the operating temperature must be higher than 0°C. The building block that forms the basis of the system contains 1.8e+06 gates. This device has a pin count of 676 in fpga semiconductor. Fpga semiconductor consists of 4160 logic blocks (LABs). It usually uses a crystal oscillating at a frequency of 280MHz in order to do its work. The FPGA implements the design by using 1800000 equivalent gates in order to achieve the desired result.
XC3SD1800A-5FG676C Features
519 I/Os
676 LABs/CLBs
85°C gates
4160 logic blocks (LABs)
XC3SD1800A-5FG676C Applications
There are a lot of Xilinx
XC3SD1800A-5FG676C FPGAs applications.
- Computer hardware emulation
- Integrating multiple SPLDs
- Voice recognition
- Cryptography
- Filtering and communication encoding
- Aerospace and Defense
- Medical Electronics
- Audio
- Automotive
- Consumer Electronics
