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XC4VLX25-11SFG363C

XC4VLX25-11SFG363C

XC4VLX25-11SFG363C

Xilinx

1.2V V 1.99mm mm FPGAs FCBGA 0.8mm mm 363

SOT-23

XC4VLX25-11SFG363C Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mount Surface Mount
Package / Case FCBGA
Number of Pins 363
JESD-609 Code e1
Pbfree Code yes
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 363
ECCN Code 3A991.D
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Max Operating Temperature 85°C
Min Operating Temperature 0°C
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.2V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 363
Number of Outputs 240
Qualification Status Not Qualified
Operating Supply Voltage 1.2V
Supply Voltage-Max (Vsup) 1.26V
Temperature Grade OTHER
Number of I/O 240
RAM Size 162kB
Clock Frequency 1205MHz
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 24192
Number of Logic Blocks (LABs) 2688
Speed Grade 11
Length 17mm
Height Seated (Max) 1.99mm
Width 17mm
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
3 $357.50000 $1072.5
XC4VLX25-11SFG363C Product Details

XC4VLX25-11SFG363C Overview


This package is included in the FCBGA package and is available for purchase. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. The I/Os are designed to facilitate a more coherent transfer of data. Logic elements/cells form the fundamental building block of a computer. 1.2V volts power it. With this device, you will be able to make use of 240 outputs. The total number of terminations is 363. During the configuration of this FPGA module, the RAM si162kBe reaches 162kB to ensure that the program runs normally. The device is designed with 363 pins in total. Fpga electronics is possible for this FPGA to perform as per fpga electronics s specifications as long as fpga electronics is mounted in Surface Mount direction. In the case of 1.2V supply voltage, designers can take full advantage of its flexibility. In this module, 85°C is the maximum operating temperature at which fpga electronics can operate. Over 0°C, the operating temperature should be higher. The device has a total of 363 pins on fpga semiconductor. In its basic building block, it is composed of 2688 logic blocks (LABs), which are called building blocks. A crystal oscillating at 1205MHz is one of the most common components of this device.

XC4VLX25-11SFG363C Features


240 I/Os
363 LABs/CLBs
85°C gates
2688 logic blocks (LABs)


XC4VLX25-11SFG363C Applications


There are a lot of Xilinx
XC4VLX25-11SFG363C FPGAs applications.


  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense
  • Medical Electronics
  • Audio

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