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XCKU100-2FLVA1760I

XCKU100-2FLVA1760I

XCKU100-2FLVA1760I

Xilinx

FPGAs BGA

SOT-23

XCKU100-2FLVA1760I Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Package / Case BGA
Max Operating Temperature100°C
Min Operating Temperature -40°C
RAM Size 7.4MB
Speed Grade 2
Number of Registers 1.09536e+06
Radiation HardeningNo
RoHS StatusRoHS Compliant
In-Stock:4343 items

XCKU100-2FLVA1760I Product Details

XCKU100-2FLVA1760I Overview


In the BGA package, you will find fpga chips. It is crucial that the RAM si7.4MBe of this FPGA module reaches 7.4MB so that the program can run normally. As a result of the design of this module, the maximum operating temperature reaches 100°C. There should be a temperature difference between -40°C and the operating temperature. Fpga semiconductor is important to note that the data is stored and transferred in 1.09536e+06 different registers.

XCKU100-2FLVA1760I Features


100°C gates
1.09536e+06 registers


XCKU100-2FLVA1760I Applications


There are a lot of Xilinx
XCKU100-2FLVA1760I FPGAs applications.


  • Software-defined radio
  • Random logic
  • ASIC prototyping
  • Medical imaging
  • Computer hardware emulation
  • Integrating multiple SPLDs
  • Voice recognition
  • Cryptography
  • Filtering and communication encoding
  • Aerospace and Defense

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