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XCR3384XL-12FG324I

XCR3384XL-12FG324I

XCR3384XL-12FG324I

Xilinx

1mm PMIC 324 Pin 3.3V FBGA

SOT-23

XCR3384XL-12FG324I Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mount Surface Mount
Package / Case FBGA
Number of Pins 324
Packaging Bulk
JESD-609 Code e0
Pbfree Code no
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 324
ECCN Code 3A991.D
Terminal Finish Tin/Lead (Sn63Pb37)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Additional Feature YES
HTS Code 8542.39.00.01
Subcategory Programmable Logic Devices
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 3.3V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) 30
Pin Count 324
Qualification Status Not Qualified
Operating Supply Voltage 3.3V
Supply Voltage-Max (Vsup) 3.6V
Temperature Grade INDUSTRIAL
Number of I/O 220
Memory Type EEPROM
Propagation Delay 12 ns
Frequency (Max) 83MHz
Programmable Logic Type EE PLD
Number of Gates 9000
Number of Logic Blocks (LABs) 24
Speed Grade 12
Output Function MACROCELL
Number of Macro Cells 384
JTAG BST YES
In-System Programmable YES
Length 23mm
Height Seated (Max) 2.5mm
Width 23mm
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead
XCR3384XL-12FG324I Product Details

XCR3384XL-12FG324I Overview


In the mobile phone network, there are 384macro cells, which are cells with high-power antennas and towers.The item is packaged with FBGA.As you can see, this device has 220 I/O ports programmed into it.There is a 324 terminations set on devices.This electrical part is wired with a terminal position of BOTTOM.There is 3.3V voltage supply for this device.This part is in the family Programmable Logic Devices.Bulk should be used for packaging the chip.There are 324 pins on the chip.Additionally, this device is capable of displaying YES.A digital circuit is built using 9000 gates.In order to maintain high efficiency, the supply voltage should be maintained at 3.3V.For storing data, it is recommended to use EEPROM.This device is mounted by Surface Mount.There are 324 pins embedded in the device.A maximum supply voltage (Vsup) of 3.6V is provided.In order to operate properly, the operating temperature should be higher than -40°C.It is recommended to keep the operating temperature below 85°C.In total, it contains 24 logic blocks (LABs).It is recommended that the maximal frequency be less than 83MHz.A programmable logic type is classified as EE PLD.

XCR3384XL-12FG324I Features


FBGA package
220 I/Os
324 pin count
324 pins
24 logic blocks (LABs)


XCR3384XL-12FG324I Applications


There are a lot of Xilinx
XCR3384XL-12FG324I CPLDs applications.


  • Power up sequencing
  • Voltage level translation
  • Timing control
  • Interface bridging
  • I/O expansion
  • Discrete logic functions
  • Bootloaders for FPGAs
  • Address decoders
  • Custom state machines
  • Digital systems

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