XA3S200-4PQG208I Overview

In the package 208-BFQFP, this product is provided. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Having 141 I/Os makes data transfers more coherent. Logic blocks consist of 4320 logic elements/cells. In order for the device to operate, a supply voltage of 1.2V volts needs to be provided. The Field Programmable Gate Arrays family of FPGA parts includes this part. Surface Mount-connectors can be used to attach this FPGA module to the development board. Powered by a 1.14V~1.26V supply voltage, fpga chips is able to operate at high speeds. The Automotive, AEC-Q100, Spartan?-3 XA Series is one of the types of FPGAs that belong to this type. The operating temperature should be kept at -40°C~100°C TJ when operating. With this device, you will be able to make use of 173 outputs. This FPGA model is contained in Tray for space saving. In total, it has a total of 208 terminations. The RAM bits that are offered by this fpga chips are 221184. Parts related to this part can be found using its base part number XA3S200. For the program to work properly, the RAM si27kBe of this FPGA module must reach 27kB GB in order to ensure normal operation. This cable has 208 pins and is designed to connect to a computer. 480 LABs/CLBs are configured on this FPGA. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. In operation with 1.2V, designers can take advantage of its flexibility to the fullest extent. Power is provided by a 1.21.2/3.32.5V battery that is included with the device. The building block that forms the basis of the system contains 200000 gates. The device has a total of 208 pins on fpga semiconductor. It usually uses a crystal oscillating at a frequency of 125MHz in order to do its work. Its architecture is based on 480 CLBs.

XA3S200-4PQG208I Features

141 I/Os
Up to 221184 RAM bits
208 LABs/CLBs

XA3S200-4PQG208I Applications

There are a lot of Xilinx Inc. XA3S200-4PQG208I FPGAs applications.

• Artificial intelligence (AI)
• Consumer Electronics
• OpenCL
• ASIC prototyping
• Defense Applications
• Radar and Sensors
• Military Temperature
• Data center search engines
• Enterprise networking
• Distributed Monetary Systems