484 Terminations -40°C~100°C TJ System On Chip Automotive, AEC-Q100, Zynq®-7000 XA Series 130 I/O
SOT-23
XA7Z030-1FBG484I Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Package / Case
484-BBGA, FCBGA
Surface Mount
YES
Operating Temperature
-40°C~100°C TJ
Packaging
Tray
Series
Automotive, AEC-Q100, Zynq®-7000 XA
Published
2010
JESD-609 Code
e1
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
4 (72 Hours)
Number of Terminations
484
ECCN Code
EAR99
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code
8542.39.00.01
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
250
Terminal Pitch
1mm
Reach Compliance Code
not_compliant
Time@Peak Reflow Temperature-Max (s)
30
JESD-30 Code
S-PBGA-B484
Qualification Status
Not Qualified
Power Supplies
11.8V
Number of I/O
130
Speed
667MHz
RAM Size
256KB
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR CIRCUIT
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals
DMA
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture
MCU, FPGA
Primary Attributes
Kintex™-7 FPGA, 125K Logic Cells
UV Erasable
N
Length
23mm
Height Seated (Max)
2.54mm
Width
23mm
RoHS Status
RoHS Compliant
XA7Z030-1FBG484I Product Details
This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).
Based on the core processor(s) Dual ARM® Cortex®-A9 MPCore™ with CoreSight™, this SoC has been developed.The manufacturer assigns this system on a chip with a 484-BBGA, FCBGA package as per the manufacturer's specifications.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the Automotive, AEC-Q100, Zynq®-7000 XA series of system on a chips.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.As one of the most important things to note is that this SoC security combines Kintex™-7 FPGA, 125K Logic Cells together.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 130 I/Os.The system on a chip uses 484 terminations in total.This system on chip SoC requires 11.8V power supply at all.The SoC meaning uses MICROPROCESSOR CIRCUIT as its interface with the peripheral ICs and uPs.
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.
256KB RAM. Built on MCU, FPGA. MICROPROCESSOR CIRCUIT
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