This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s) are used in the construction of this SoC.Manufacturer assigns package 484-BBGA, FCBGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 256KB RAM.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the Automotive, AEC-Q100, Zynq®-7000 XA series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be -40°C~125°C TJ.Taking note of the fact that this SoC security combines Kintex™-7 FPGA, 125K Logic Cells is important.An advanced Tray package houses this SoC system on a chip.In total, this SoC part has 130 I/Os.A system on a chip benefits from having 484 terminations.In order to operate system on chip, you will need 11.8V power supplies.It uses MICROPROCESSOR CIRCUIT as its processor, controller, and peripheral SoCs.

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.

256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT

There are a lot of Xilinx Inc.

XA7Z030-1FBG484Q System On Chip (SoC) applications.

• Industrial robot
• High-end PLC
• Vending machines
• POS Terminals
• Measurement tools
• Measurement testers
• Networked sensors
• Robotics
• Central alarm system
• Smart appliances