This SoC is built on Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s).

A Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 484-BBGA, FCBGA package.With 256KB RAM implemented, this SoC chip provides users with reliable performance.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.Featured system on chip SoCs of the Automotive, AEC-Q100, Zynq®-7000 XA series.The average operating temps for this SoC meaning should be -40°C~125°C TJ.One important thing to mark down is that this SoC meaning combines Kintex™-7 FPGA, 125K Logic Cells.Housed in the state-of-art Tray package.130 I/Os in total are included in this SoC part.There are 484 terminations in total and that really benefits system on a chip.It uses MICROPROCESSOR CIRCUIT as a uPs/uCs/Peripheral SoC.

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ processor.

256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT

There are a lot of Xilinx Inc.

XA7Z030-1FBV484Q System On Chip (SoC) applications.

• Automotive gateway
• Body control module
• Industrial transport
• Industrial robot
• High-end PLC
• Vending machines
• POS Terminals
• Measurement tools
• Measurement testers
• Networked sensors