This SoC is built on Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 core processor(s).

A core processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 is embedded in this SoC.It has been assigned a package 625-BFBGA, FCBGA by its manufacturer for this system on a chip.This SoC chip is equipped with 1.8MB RAM and guarantees reliable performance to the user.The internal architecture of this SoC design utilizes the MPU, FPGA technique.Zynq® UltraScale+™ MPSoC EG is the series number of this system on chip SoC.In general, this SoC meaning should operate at a temperature of -40°C~125°C TJ on a regular basis.This SoC security combines Zynq®UltraScale+™ FPGA, 154K+ Logic Cells and that is something to note.This SoC system on a chip has been designed in a state-of-the-art Tray package.This SoC part contains a total of 128 I/Os in total.A power supply with a 0.85V voltage rating should be utilized when using this system on chip SoC.As a result, there are 625 terminations in total, which does really benefit system on a chip.MICROPROCESSOR CIRCUIT served as its uPs, uCs, and peripheral integrated circuits.

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 processor.

1.8MB RAM.
Built on MPU, FPGA.
MICROPROCESSOR CIRCUIT

There are a lot of Xilinx Inc.

XAZU3EG-1SFVA625Q System On Chip (SoC) applications.

• Measurement tools
• Measurement testers
• Networked sensors
• Robotics
• Central alarm system
• Smart appliances
• Industrial automation devices
• Sports
• Fitness
• Healthcare