XC17S150APD8I Overview

This package makes use of the 8-DIP (0.300, 7.62mm) programming language.Packaging outside of Tube.As a qualified employee, I can operate within -40°C~85°C.This device can be programmed using OTP.A voltage of 3V~3.6V is applied to it.Mounted in Through Hole is this memory device.1.5Mb is the maximum storage size.Search "XC17S150A" for related parts.The supply voltage of the device must be 3.3V in order to operate correctly.Various functions can be applied to 8 terminations.A maximum voltage of 3.6V can be applied to this memory device.FPGA is imperative that the voltage of the device supply is at least 3V if the device is to work properly.An CONFIGURATION MEMORY memory chip.Reflow soldering should be done at 225°C maximum.There are 8 pins on it.With the help of SERIAL-processing, data is sent through this memory.The memory chip operates at a voltage of no more than 0.005mA.8 pins are set with the part.Memory is configured as COMMON for memory's I/O.Memory is recommended that users apply 3.3V to the part before use in order for Memory to function safely in a circuMemory.

XC17S150APD8I Features

Operating temperature: -40°C~85°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.

XC17S150APD8I Applications

There are a lot of Xilinx Inc. XC17S150APD8I applications of configuration proms for FPGAs.

• data buffer
• main computer memory
• personal computers
• nonvolatile BIOS memory
• embedded logic
• cell phones
• hard disk drive (HDD)
• DVD disk buffer
• workstations,
• multimedia computers