XC17S200APD8C Overview

8-DIP (0.300, 7.62mm) is used in this package.The external packaging of Tube is made of Tube plastic.Qualified to perform a variety of tasks within the 0°C~70°C environment.Using OTP, you can program it.There is a voltage of 3V~3.6V applied to the device.Through Hole is the orientation of this memory device.A data storage size of 2Mb is allowed.Other components related to "XC17S200A" can also be found by searching the word.Supply voltage 3.3V is required.A termination with different functions in the 8 axis.FPGA is possible to use this memory device at a maximum voltage of 3.6V.Minimum voltage 3V is required for the device to work.This is a CONFIGURATION MEMORY memory chip.If you're reflow soldering, you shouldn't go above 225.There are 8 pins on it.Data is transmitted in this memory using a SERIAL process.The memory chip is allowed to operate at a voltage that is no greater than 0.015mA.8 pins are set with the part.There is a COMMON configuration for the memory's I/O.A 3.3V application is recommended before using the part in a circuit to ensure the part runs safely and reliably.

XC17S200APD8C Features

Operating temperature: 0°C~70°C.
OTP program capability.
CONFIGURATION MEMORY memory IC.
SERIAL processing.
COMMON I/O equipped.

XC17S200APD8C Applications

There are a lot of Xilinx Inc. XC17S200APD8C applications of configuration proms for FPGAs.

• networks
• servers
• workstations,
• hard disk drive (HDD)
• printers
• networking
• data buffer
• main computer memory
• personal digital assistants
• DVD disk buffer