XC17S30XLPDG8C Overview

The package uses a neat 8-DIP (0.300, 7.62mm) interface.Packaging for Tube.Qualified to perform a variety of tasks within the 0°C~70°C environment.OTP allows for programmability.With a voltage of 3V~3.6V, it is powered.Mounted in Through Hole is this memory device.The size of data storage is limited to 300kb.Look for "XC17S30XL" for other related parts.Supply voltage 3.3V is required.Different functions are associated with 8 terminations.As long as the maximum voltage of the memory device is 3.6V, then the memory device can be used.It is necessary to supply the device with a minimum voltage of 3V.When soldering in reflow mode, the temperature should be kept below 250 at all times during the soldering process.Pins on it are 8-shaped.The memory chip is allowed to operate from a voltage no higher than 0.005mA.The part comes with a set of 8 pins.Speaking of speed, this is a memory IC that can work at a 10MHz frequency.There is a COMMON configuration for the memory's I/O.Memory is recommended to use a 3.3V power supply.The PROM memory is also referred to as the X memory.

XC17S30XLPDG8C Features

Operating temperature: 0°C~70°C.
OTP program capability.
COMMON I/O equipped.
PROM memory

XC17S30XLPDG8C Applications

There are a lot of Xilinx Inc. XC17S30XLPDG8C applications of configuration proms for FPGAs.

• embedded logic
• graphics card
• personal digital assistants
• personal computers
• networking
• mainframes
• main computer memory
• nonvolatile BIOS memory
• data buffer
• multimedia computers