XC17S30XLVO8I Overview

An interesting 8-SOIC (0.154, 3.90mm Width) package is used.Packing on the outside is Tube.Qualified to perform a variety of tasks within the -40°C~85°C environment.This device can be programmed using the OTP language.This device is fed with a voltage of 3V~3.6V which is applied to it.Surface Mount is the mounting position of this memory device.FPGA is limFPGAed to 300kb bytes for the size of the data storage.Try searching "XC17S30XL" for more parts.FPGA reuqires a supply voltage of 3.3V.Various functions can be applied to 8 terminations.There is a maximum voltage of 3.6V that can be applied to this memory device.3V is the minimum voltage required to supply the device.Using MEMORY CIRCUIT memory chips, this is what you get.The 8 pins are on the board.The memory chip is allowed to operate at a voltage that is no greater than 0.005mA.With the part are included 8 pins.When it comes to speed, this is a memory IC that can work at a frequency of 10MHz, which is very fast.The I/O configuration of the memory is COMMON.A power supply that is rated at 3.3V is recommended for use with this product.

XC17S30XLVO8I Features

Operating temperature: -40°C~85°C.
OTP program capability.
MEMORY CIRCUIT memory IC.
COMMON I/O equipped.

XC17S30XLVO8I Applications

There are a lot of Xilinx Inc. XC17S30XLVO8I applications of configuration proms for FPGAs.

• main computer memory
• Cache memory
• DVD disk buffer
• networking
• nonvolatile BIOS memory
• hard disk drive (HDD)
• personal digital assistants
• networks
• eDRAM
• graphics card