2.5V V 4.1mm mm FPGAs Spartan?-II Series 208-BFQFP 0.5mm mm 208
SOT-23
XC2S50-6PQG208C Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
10 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
208-BFQFP
Number of Pins
208
Operating Temperature
0°C~85°C TJ
Packaging
Tray
Published
2008
Series
Spartan®-II
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
208
ECCN Code
EAR99
Terminal Finish
Matte Tin (Sn)
HTS Code
8542.39.00.01
Subcategory
Field Programmable Gate Arrays
Voltage - Supply
2.375V~2.625V
Terminal Position
QUAD
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
245
Supply Voltage
2.5V
Terminal Pitch
0.5mm
[email protected] Reflow Temperature-Max (s)
30
Pin Count
208
Number of Outputs
176
Qualification Status
Not Qualified
Operating Supply Voltage
2.5V
Number of I/O
140
RAM Size
4kB
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
1728
Total RAM Bits
32768
Number of Gates
50000
Number of LABs/CLBs
384
Speed Grade
6
Number of CLBs
384
Height Seated (Max)
4.1mm
Length
28mm
Width
28mm
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
48
$21.98000
$1055.04
XC2S50-6PQG208C Product Details
XC2S50-6PQG208C Overview
In the package 208-BFQFP, this product is provided. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 140 I/Os are programmed to ensure a more coherent data transfer. There are 1728 logic elements/cells to form a fundamental building block. Fpga chips is powered from a supply voltage of 2.5V. Field Programmable Gate Arrays family FPGA part. An attachment Surface Mount allows the FPGA module to be attached to the development board. With a supply voltage of 2.375V~2.625V, this device operates with ease. FPGAs belonging to the Spartan?-II series are a type of FPGA that belong to the Spartan?-II series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. A total of 176 outputs are incorporated into this device. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. Fpga chips is designed wFpga chipsh 208 terminations. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 32768 bFpga chipss. For the program to work properly, the RAM si4kBe of this FPGA module must reach 4kB GB in order to ensure normal operation. This cable has 208 pins and is designed to connect to a computer. 384 LABs/CLBs are configured on this FPGA. Having stated that, if this FPGA is mounted in Surface Mount, then it may be able to perform fantastically according to its specifications. In the case of 2.5V supply voltage, designers can take full advantage of its flexibility. Fpga semiconductor is made up of 50000 gates as fpga semiconductors basic building block. This device has a pin count of 208 in fpga semiconductor. In order to make the architecture work, 384 CLBs are used.
XC2S50-6PQG208C Features
140 I/Os Up to 32768 RAM bits 208 LABs/CLBs
XC2S50-6PQG208C Applications
There are a lot of Xilinx Inc. XC2S50-6PQG208C FPGAs applications.