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XC2V6000-6FFG1517C

XC2V6000-6FFG1517C

XC2V6000-6FFG1517C

Xilinx Inc.

1.5V V FPGAs Virtex?-II Series 1517-BBGA, FCBGA

SOT-23

XC2V6000-6FFG1517C Datasheet

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Specifications
Name Value
Type Parameter
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 1517-BBGA, FCBGA
Number of Pins 1517
Supplier Device Package 1517-FCBGA (40x40)
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2007
Series Virtex®-II
Part Status Obsolete
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Max Operating Temperature 85°C
Min Operating Temperature 0°C
Voltage - Supply 1.425V~1.575V
Base Part Number XC2V6000
Operating Supply Voltage 1.5V
Number of I/O 1104
RAM Size 324kB
Total RAM Bits 2654208
Number of Gates 6000000
Number of LABs/CLBs 8448
Number of Logic Blocks (LABs) 8448
Speed Grade 6
Number of Registers 67584
Radiation Hardening No
RoHS Status RoHS Compliant
XC2V6000-6FFG1517C Product Details

XC2V6000-6FFG1517C Overview


Fpga chips is supplied in the 1517-BBGA, FCBGA package. The device has 1104 I/O ports for more coherent data transfer. The Surface Mount-slot on the development board allows you to attach the FPGA module. A supply voltage of 1.425V~1.575V is needed in order for fpga chips to operate. The Virtex?-II series FPGA is a type of FPGA that belongs to the Virtex?-II family of FPGAs. When operating the machine, it is important to keep the temperature within 0°C~85°C TJ range. It is for space saving reasons that this FPGA model is contained in Tray. Having a RAM bit size of 2654208 means that this device will offer you a lot of memory. In order to find related parts, you can use its base part number XC2V6000. The RAM si324kBe of this FPGA module reaches 324kB to ensure normal operation of the program. The device has 1517 pins which are included in the design. 8448 LABs/CLBs are configured on this FPGA. As long as this FPGA is mounted in Surface Mount, it should be able to function as it should in terms of its specifications, as well as its capabilities. With a 1.5V supply voltage, designers can fully utilize the flexibility of the device. As a result of the design of this module, the maximum operating temperature reaches 85°C. There should be a temperature difference between 0°C and the operating temperature. As a basic building block, fpga semiconductor consists of 6000000 gates. Fpga semiconductor consists of 8448 logic blocks (LABs). A total of 67584 registers are used for storing and transferring data between them. There is a device package provided by 1517-FCBGA (40x40), which is the supplier.

XC2V6000-6FFG1517C Features


1104 I/Os
Up to 2654208 RAM bits
1517 LABs/CLBs
85°C gates
8448 logic blocks (LABs)
67584 registers

XC2V6000-6FFG1517C Applications


There are a lot of Xilinx Inc. XC2V6000-6FFG1517C FPGAs applications.

  • Audio
  • Data center hardware accelerators
  • ADAS
  • Military Temperature
  • Random logic
  • Medical ultrasounds
  • Image processing
  • Data Center
  • Security systems
  • Aircraft navigation

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