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XC3S1000L-4FGG676C

XC3S1000L-4FGG676C

XC3S1000L-4FGG676C

Xilinx Inc.

FPGAs Spartan?-3L Series 676-BGA

SOT-23

XC3S1000L-4FGG676C Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 676-BGA
Supplier Device Package 676-FBGA (27x27)
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 1999
Series Spartan®-3L
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 85°C
Min Operating Temperature 0°C
Voltage - Supply 1.14V~1.26V
Base Part Number XC3S1000L
Number of I/O 391
RAM Size 54kB
Number of Logic Elements/Cells 17280
Total RAM Bits 442368
Number of Gates 1000000
Number of LABs/CLBs 480
Number of Logic Blocks (LABs) 480
RoHS Status RoHS Compliant
XC3S1000L-4FGG676C Product Details

XC3S1000L-4FGG676C Overview


In the 676-BGA package, you will find fpga chips. This device features 391 I/Os in order to transfer data in a more efficient manner. Logic blocks consist of 17280 logic elements/cells. Using a Surface Mount connector, you can mount this FPGA module on the development board. With a supply voltage of 1.14V~1.26V, this device operates with ease. FPGAs belonging to the Spartan?-3L series are a type of FPGA that belong to the Spartan?-3L series of FPGAs. Operating temperatures should be maintained within the 0°C~85°C TJ range at all times when the unit is in use. As a result of space limitations, this FPGA model has been included in Tray. As far as the RAM bits are concerned, this device offers you a total of 442368. Its base part number XC3S1000L can be used to find related parts. A significant amount of RAM is allocated to this FPGA module to ensure that the program can operate normally. This FPGA is built as an array of 480 LABs/CLBs. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. As a result of the design of this module, the maximum operating temperature reaches 85°C. 0°C should be higher than the operating temperature. As a basic building block, fpga semiconductor consists of 1000000 gates. The basic building block of the system is composed of 480 logic blocks (LABs). As a supplier, 676-FBGA (27x27) is responsible for the package of its devices.

XC3S1000L-4FGG676C Features


391 I/Os
Up to 442368 RAM bits
85°C gates
480 logic blocks (LABs)

XC3S1000L-4FGG676C Applications


There are a lot of Xilinx Inc. XC3S1000L-4FGG676C FPGAs applications.

  • Device controllers
  • Embedded Vision
  • Enterprise networking
  • Automotive advanced driver assistance systems (ADAS)
  • Industrial Ethernet
  • Server Applications
  • Wireless Communications
  • Software-defined radios
  • Software-defined radio
  • Telecommunication

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