XC3S1500L-4FGG676C Overview

As part of the 676-BGA package, it is included. The I/Os are designed to facilitate a more coherent transfer of data. A fundamental building block consists of 29952 logic elements/cells. The Surface Mount-slot connector on the FPGA module can be connected to the development board. A supply voltage of 1.14V~1.26V is needed in order for fpga chips to operate. This is a type of FPGA that is part of the Spartan?-3L series of FPGAs. While operating, the operating temperature should be kept within a range of 0°C~85°C TJ. This FPGA model is contained in Tray for space saving. There are 589824 RAM bits that are available with this device. Parts related to this part can be found using its base part number XC3S1500L. Fpga electronics is important that this FPGA module has a RAM si72kBe of 72kB in order to ensure that the program will run normally. The FPGA consists of 2816 LABs/CLBs. Having stated that, if this FPGA is mounted in Surface Mount, then it may be able to perform fantastically according to its specifications. As far as the maximum operating temperature of this module is concerned, it reaches 85°C. 0°C should be higher than the operating temperature. Its basic building block contains 1500000 gates. Fpga semiconductor consists of 2816 logic blocks (LABs). The device package supplied by 676-FBGA (27x27) is one of its suppliers.

XC3S1500L-4FGG676C Features

487 I/Os
Up to 589824 RAM bits
85°C gates
2816 logic blocks (LABs)

XC3S1500L-4FGG676C Applications

There are a lot of Xilinx Inc. XC3S1500L-4FGG676C FPGAs applications.

• Aerospace and Defense
• Defense Applications
• Military DSP
• Embedded Vision
• Medical Electronics
• Audio
• Cryptography
• Distributed Monetary Systems
• Industrial,Medical and Scientific Instruments
• Scientific Instruments