XC3S1600E-5FG400C Overview

The package that contains this software is called 400-BGA. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. 304 I/Os are available for transferring data more efficiently. There are 33192 logic elements/cells to form a fundamental building block. Power is provided by a 1.2V-volt supply. The Field Programmable Gate Arrays family of FPGAs includes this part. With a Surface Mount connector, this FPGA module can be attached to the development board. Fpga chips operates wFpga chipsh a supply voltage of 1.14V~1.26V. An FPGA belonging to the Spartan?-3E series is referred to as an FPGA. While operating, the operating temperature should be kept within a range of 0°C~85°C TJ. In this device, there are 132 outputs that can be used. Fpga chips is designed to maximiBulke space efficiency by containing the FPGA model in Bulk. In total, the terminations of this piece are 400. Fpga electronics is worth mentioning that this device provides 663552 bfpga electronics s of RAM. It is crucial that the RAM si81kBe of this FPGA module reaches 81kB so that the program can run normally. 3688 LABs and CLBs are built into this FPGA. In operation with 1.2V, designers can take advantage of its flexibility to the fullest extent. As a basic building block, fpga semiconductor consists of 1600000 gates. Fpga semiconductor is equipped wfpga semiconductorh 400 pin count. The structure of the registers used to store and transfer data consists of 29504 registers.

XC3S1600E-5FG400C Features

304 I/Os
Up to 663552 RAM bits
29504 registers

XC3S1600E-5FG400C Applications

There are a lot of Xilinx Inc. XC3S1600E-5FG400C FPGAs applications.

• Aircraft navigation
• Ecosystem
• Enterprise networking
• OpenCL
• Security systems
• Data center search engines
• Wired Communications
• Image processing
• Random logic
• Camera time adjustments